U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips

Leave a Comment / Commerce Department, Computer Chips, Containers and Packaging, Corporations, Factories and Manufacturing, National Institute of Standards and Technology, Taiwan Semiconductor Manufacturing Company Ltd

U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer ChipsThe proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.

Powered by WPeMatico

http://rss.nytimes.com/services/xml/rss/nyt/Technology.xmlNYT > Technologyhttps://static01.nyt.com/images/misc/NYT_logo_rss_250x40.pngTechnology124Don Clark

Leave a Comment

Your email address will not be published. Required fields are marked *


Buy Now

Are You Ready To Go

Go to Qshop to access all our products and services in one easy click!!

Qshop
Scroll to Top